17 Jun 2026
Failure Analysis & Root Cause Investigation
Reliable products require a clear understanding of failure mechanisms and potential weaknesses. TechnoLab provides comprehensive failure analysis services for electrotechnical and electronic components throughout the product lifecycle.
Our experts investigate defects, identify root causes, and assess the reliability and service life of components and assemblies. Whether addressing production failures, field returns, thermal incidents, or long-term degradation processes, we deliver actionable insights that support quality improvement and risk reduction.
Our portfolio includes:
Technical Failure Analysis
Root Cause Analysis (RCA)
Failure Investigation
Forensic Engineering & Forensic Failure Analysis
Thermal Incident Investigations
Degradation Mechanism Analysis
Reliability and Lifetime Assessment
Analytical capabilities:
Visual and microscopic inspections
Electrical testing
X-ray inspection and 3D X-ray analysis
Metallography and cross-section analysis
SEM/EDS material characterization
FTIR spectroscopy
Solderability testing
Dye-and-pry testing
Customer benefits:
Rapid identification of failure causes
Reduced production downtime
Improved product quality and reliability
Support for manufacturing optimization
Evidence-based decision-making for quality assurance and product development
TechnoLab performs all investigations in accordance with relevant international standards and industry best practices, providing reliable and traceable results for demanding industrial applications.

